Custom laser application development for your production
High-resolution conductive traces can be formed on polymers, glass, ceramics, silicon and other dielectric materials. Trace width can go below 5 µm.
Precision marking of multiple materials, from corrosion resistant black marking of stainless steel to micro marking of glass and polymers. Multi-color marking technology for metals and ceramics.
Precise drilling of holes in a variety of materials, ranging from glass and plastics to metals and ceramics.
Ultrafast lasers are a great tool for selective material etching with low surface roughness.
Laser cutting of various materials with micron level accuracy.
Selective Laser Etching to minimize tapering and surface chipping on transparent materials.