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High-resolution conductive traces can be formed on polymers, glass, ceramics, silicon and other dielectric materials. Trace width can go below 5 µm.

  • With a patented SSAIL technology conductive traces can be formed on many standard dielectric materials (polymers, ceramics, glass, silicon). It enables tighter electronics packaging on flat or 3D surfaces (with traces down to 1 µm width), making antennas directly on/in parts and creating functional surfaces.


    SSAIL is a two-step process:

    1. Laser activation of the surface for traces. It is done by scanning the surface with a laser beam. 

    2. After the laser activation, the part goes through a chemical process: 

    a) Chemical activation is done with a special solution, which prepares laser-activated areas for electroless plating.

    b) Electroless plating with copper and passivation layers (nickel, silver, gold).


    Using SSAIL technology electrical traces can be used on different types of parts:

    • 3D surfaces
    • Thin films
    • Flexible materials
    • Through via plating

    On most materials, a trace width of 15 µm can be achieved (down to 1 µm on some materials). Process speed depends on trace width and substrate material and can reach several hundreds of mm2/s.


    The technology works on many different dielectric materials. Some of the materials include:

    PC/ABS PPS Getinax
    PA6 PF FR-4
    PVC PI Epoxy
    PMMA PC/ABS for 3D printing RO3003™ Laminates
    PET PTFE SITAL ceramic
    PEEK ABF Al2O3 ceramic
    PPA PA4 Glass (soda lime)
    LCP PBS Fused Silica
    PBT PREP 200 Silicon
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