Laser etching

Ultrafast lasers are a great tool for selective material etching with low surface roughness.

Using cold ablation, the melting and burning of the material are minimized, achieving an unmatched surface quality. High absorption of ultrashort laser pulses allows a selective ablation of thin material layers.

Ultrashort pulse laser drilling offers exceptional precision, facilitating the formation of micro-holes with elevated aspect ratios and reduced thermal effects. In contrast to traditional mechanical drilling, laser drilling is a non-contact method that eliminates tool wear and minimizes contamination risks. The cold ablation process guarantees clean, smooth edges devoid of burrs, cracks, or material deformation, thereby obviating the necessity for post-processing.

A significant advantage is the capacity to drill diverse materials, encompassing brittle and hard substances such as glass, ceramics, and sapphire, in addition to metals and polymers. Laser drilling is applicable to both flat and intricate 3D geometries, rendering it a crucial technology in sectors such as aerospace, automotive, electronics, and medical devices. Laser drilling improves manufacturing efficiency through its rapidity, accuracy, and adaptability to various materials, all while ensuring superior quality and dependability.

Some of the materials etched with AKO machines:

• Glass
• Sapphire
• Various polymers
• Copper
• PCD, Tungsten Carbide
• Ceramics